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Kawasho Electronics Corporation
2-17-4 Kuramae, Taito-ku Tokyo, Japan
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Kawasho Electronics Corporation |
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| By an incredible pace of developing and evolving of the Information Technology, variable home electrical appliances and electronic devices are demanding to be comprised of network each other, and to be comprised of mobility and further, are demanding high efficiency, miniaturization, and light weight. In order to meet this market trends, miniaturization and high density of electronic components and configured PCBs are the current theme.
To support this trends in high performance and miniaturization of electronic components, Kawasho electronics has been focusing on surface mounting technology for high-speed and high-density electronics parts and has been marketing superior SMT (Surface Mounting Technology), COB (Bare Chip Mounting) and FPD(Flat Panel Display) equipments both domestically and abroad. On top of that, we are solving customer's problems by providing total solutions from complete production system proposals through to maintenance. Also, to support domestic customers who are sifting production bases to Asia and to support Asian customers, we are providing not just marketing, but also engineering support and services in Malaysia, Thailand and China.
We offer wide range of products.
To say nothing of JISSO System for Semiconductors, we also offer wide range of products which can widely utilized for the production of flip-chip, LCD and etc.
We assure you excellent after-sales services such as maintenance services, technical supports and so on. |
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Electronic Component Mounting/Placement Machine CM402-M/L
Compact and high space productivity
Ultra-high-speed placement is achieved by utilizing multiple heads and an extremely accurate recognition system.In addition, the main body has a space-saving small foot print.
Intelligent feeder
Tape feed pitch can be set digitally. The parts count recoding function issues a warning
when the number of parts remaining is low. For the 8 mm tape, up to 216 components can be placed.
Realizes the capability to support a wide variety of parts and high efficiency
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Fine Device Bonding/Bonder for Flat Panel Display TBX-P/S
Features:
Flexible Machine for Bonding Process
Thanks to the industry's first PLUG IN idea, the component feeding units can be attached, detached, or exchanged without restraint. Also, the peripherals can be connected on site.
Quick Model Change
Through all-in-one control by one CPU, overlapping input items are eliminated and the changeover time becomes 1/2 to 1/3 as short as that in our competitor's machine.
High Speed Bonding
Through double-ACF attachment and high-speed rotary pre-bonding head, a 30% speedup is achieved as compared with our conventional machine.
High Accurate Bonding
High-precision bonding is achieved through the adoption of the simultaneous recognition by the double-field-of-view camera, rack-and-pinion theta-table, and high-rigid frame.
High Efficiency
Downtime can be reduced through the use of the ACF cassette, sheet-feeding cassette, and repair stocker. |
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Fine Device Bonding/Plasma Cleaner PSX303
Features:
The reason why an extra-thin gold plated electrode can be used
When a extra-thin gold plated electrode is used, nickel compounds are formed on a surface after the heat treatment by the die-bonding cure. These nickel compounds impair the wire bonding performance, thus it is said that a thin gold plated electrode is unsuitable for wire bonding. However, the argon plasma treatment eliminates the nickel compounds, therefore stable wire bonding can be performed on an extra-thin and extra-cheap gold plated electrode.
Surface reforming by oxygen plasma
Surface reforming by oxygen radical improves mold resin adhesion and under-fill wettability. [option] |
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Contact Information
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Kawasho Electronics Corporation |
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| Company Name: | | Kawasho Electronics Corporation |
| Contact Person: | | |
| Address: | | 2-17-4 Kuramae, Taito-ku Tokyo, Japan |
| Phone: | | 81-3-5823-5075 |
| Fax: | | 81-3-5823-5070 |
| E-mail: | | Send Message |
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